Scribe lines for increasing wafer utilizable area
AssigneeAMIC Technology Corporation
InventorChien-Chih Fu
Life of this patent
Estimating the term…
Abstract
Scribe lines for increasing a wafer utilizable area are provided. The scribe lines include at least a first scribe line arranged in a first direction in a first gap of a plurality of dies, and at least a second scribe line arranged in the first direction in a second gap of the dies. The first scribe line includes at least an alignment mark or a test key, therefore having a width greater than a width of the second scribe line that is provided for dicing a wafer into a plurality of individual dies. In addition, the scribe lines further include a plurality groups of scribe lines arranged in different directions, and each group of the scribe lines may have various scribe line widths.
Claims21
Scribe lines for increasing a utilizable area on a wafer, the wafer comprising a plurality of dies, the scribe lines comprising:
- at least a first scribe line arranged in a first direction in a first gap of the dies, the first scribe line having a first width;
- and
- at least a second scribe line arranged in the first direction in a second gap of the dies, the second scribe line having a second width narrower than the first width.
Scribe lines on a wafer, the wafer comprising a plurality of dies, the scribe lines comprising:
- a plurality of first scribe lines positioned in gaps of the dies, each of the first scribe lines comprising a predetermined pattern;
- and
- a plurality of second scribe lines positioned in gaps of the dies, the second scribe lines being narrower than the first scribe lines.
Dependencies are inferred from the claim text.