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AssigneeTexas Instruments Incorporated
InventorsRaymond M. Partosa, Allan C. Soriano, Enrique R. Ferrer JR., Ramil A. Viluan, Melvin B. Alviar, Jose Franco A. Alicante
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A work station for a chip bonder, and/or for a wire bonder includes a clampless, porous ceramic vacuum chuck where the substrate under assembly is securely and uniformly held by vacuum applied through many tiny pores distributed across the work surface. Porous ceramic work stations are applicable to a family of packages, or to a substrate outline, and may include one or more chips within the same indexing operation. Reliability and yield of the assembled semiconductor devices is enhanced by avoiding uneven or warped substrates. In addition, the porous ceramic work holder provides a cost effective apparatus by eliminating device specific clamps and work holders, the time required for change-out and set-up.
1- A bonder work station for supporting and securing the substrates of one or more semiconductor device under assembly including;
2- A work station as in claim 1 wherein said bonder is a chip mounter/bonder.
3- A work station as in claim 1 wherein said bonder is a wire bonder.
4- A work station as in claim 1 wherein uniform vacuum pressure is applied to the substrate of a device under assembly through pores in said ceramic plate.
5- A work station as in claim 1 wherein the surface of said ceramic plate is flat and parallel to the base.
6- A work station as in claim 1 wherein each of said ceramic plates supports one or more semiconductor devices.
7- A work station as in claim 1 said assemblage functions as a vacuum chuck.
8- A work station as in claim 1 wherein said base is a heater block.
9- A work station as in claim 1 wherein the porous ceramic plate comprises aluminum oxide.
10- A work station an in claim 1 wherein the porous ceramic plate comprises silicon carbide.
11- A work station as in claim 1 wherein the porous ceramic plate comprises aluminum nitride.
12- A work station as in claim 1 wherein the porous ceramic comprises silicon nitride.
13- A work station as in claim 1 wherein said base comprises tooled steel.
14- A work station as in claim 1 wherein said assemblage is retrofitted into an existing bonder.
15- A work station as in claim 1 wherein the assemblage is applicable to the assembly of devices having a flexible tape substrate.
16- A work station as in claim 1 wherein the assemblage applicable to the support of one or more planar substrates.
17- A work station as in claim 1 wherein the ceramic plates are in the range of 2.5 to 2.9 mm thick.
18- A work station as in claim 1 wherein the pore sizes of said ceramic plates are an average of 25 microns in diameter.
19- A work station as in claim 1 wherein the open pore rate of said ceramic plates is an average of 39%.