Method for manufacturing non-volatile semiconductor memory device
AssigneeNEC Electronics Corporation
InventorFumihiko Hayashi
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Abstract
There is provided a provided method for manufacturing a non-volatile semiconductor memory device, wherein during a time when a silicon substrate is being annealed in an atmosphere containing N2O or NO to perform the processing of nitriding on a tunnel oxide film in a memory cell portion peripheral circuit portion is covered with a mask which is made up of a multilayer structure of a masking poly-silicon film and a silicon oxide film and which has a masking action against nitrogen.
Claims10
A method for manufacturing a non-volatile semiconductor memory device comprising a semiconductor substrate, a memory cell portion formed on said semiconductor substrate and storing information, and a peripheral circuit portion formed on said semiconductor substrate and controlling an operation of said memory cell portion, said method comprising the steps of:
- forming a tunnel insulation film on a surface of said semiconductor substrate in said memory cell portion and then performing a processing of nitriding on said tunnel insulation film, covering said peripheral circuit portion with a mask having a masking action against nitrogen.
A method for manufacturing a non-volatile semiconductor memory device comprised of, on a semiconductor substrate, a memory cell portion which stores information and a peripheral circuit portion which controls an operation of said memory cell portion, said method comprising the steps of:
- separating said semiconductor substrate into said memory cell portion and said peripheral circuit portion by an element isolation region and then sequentially forming a sacrificial insulation film and a masking material having a masking action against nitrogen in each of said memory cell portion and said peripheral circuit portion;
- removing said masking material and said sacrificial insulation film only in said memory cell portion to expose a surface of said semiconductor substrate and then forming a tunnel insulation film on said surface of said semiconductor substrate;
- performing annealing processing on said semiconductor substrate in an atmosphere containing at least nitrogen to perform a processing of nitriding on said tunnel insulation film;
- and
- removing a nitride formed by said processing of nitriding on said masking material in said peripheral circuit portion at the same time as said masking material to thereby expose said surface of said semiconductor substrate and then forming a gate insulation film for a peripheral transistor on said surface of said semiconductor substrate.
Dependencies are inferred from the claim text.