Film vapor deposition method

Abstract

There is provided a method of vapor depositing a film such that the film is not thermally damaged or broken by avoiding effects of heat and electrification of the film accompanied by the heating for melting, when a vapor deposition material is molten in vapor deposition preparation steps of the film, and a loss of the film can be decreased as compared with the conventional method, whereby the film can be moved and vapor-deposited stably. The film vapor deposition method is for forming a thin film on a long film 2 comprising aromatic polyamide in vacuum. During a material to be vapor-deposited is molten, the long film 2 is stood by or moved at a very low speed of 1 m/min or less under the condition that a shielding plate 9 between the material to be vapor-deposited and the long film 2 is closed. Once the material to be vapor-deposited is completely molten, the base film 2 is started to be moved substantially. At the same time or thereafter, the shielding plate 9 is open.

Dependencies are inferred from the claim text.