Blindmate heat sink assembly
AssigneeHewlett-Packard Development Company, L.P.
InventorsJohn P. Franz, Wade David Vinson
Life of this patent
Estimating the term…
Loading patent…
AssigneeHewlett-Packard Development Company, L.P.
InventorsJohn P. Franz, Wade David Vinson
Estimating the term…
A heat sink and processor assembly that can be easily installed and uninstalled from a circuit board without tools. One preferred embodiment of the heat sink assembly comprises a heat sink component, an alignment cage attached to the base of the heat sink and having an attachment point for releasably attaching a processor. The heat sink assembly further comprises a plurality of alignment pins and alignment tabs that are affixed to the base of the heat sink and interface with a specially designed socket and circuit board so as to align the mating components. The processor chip is installed onto the heat sink and then the combined assembly is installed onto a circuit board mounted socket. The alignment mechanisms provide a method for installing a processor without using tools or having to manually align the processor pins to the socket receptacles.
A computer assembly comprising:
A method of installing an integrated circuit chip and heat sink onto a socket mounted to a circuit board, the method comprising steps:
A heat sink assembly comprising:
A integrated circuit chip socket having an open and closed position, the socket comprising:
A computer assembly comprising:
A method for removing an integrated circuit chip and heat sink from a circuit board comprising:
A computer assembly comprising:
A method of installing a multi-pin electrical component and heat sink onto a socket mounted to a circuit board, the method comprising steps:
Dependencies are inferred from the claim text.