Thermal module
OwnerNien-Tien Cheng, Chien-Tu Cheng +1inventors
InventorsNien-Tien Cheng, Chien-Tu Cheng, Yi-Chang Liu
Life of this patent
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Abstract
A thermal module (1) includes a base (30), a fin group (40), a heat pipe (50) and a connective interface. The fin group comprises a plurality of closely-spaced parallel fins (42). A first end of the heat pipe is attached to the base, and an opposite second end of the heat pipe is received in a slot defined in the fin group. The connective interface is disposed between the second end of the heat pipe and the fin group. The connective interface has high thermal conductivity, and readily connects with the heat pipe and the fin group.
Claims8
A thermal module comprising:
- a base;
- a heat pipe having a first end attached to the base and an opposite second end;
- a fin group defining a slot receiving the second end of the heat pipe therein;
- and
- a connective interface disposed between the second end of the heat pipe and the fin group.
A method of removal of heat from a heat generating device, comprising the steps of:
- providing a base attached to the heat generating device;
- attaching one end of a heat pipe to said base;
- providing a fin group with therein a slot receiving an opposite end of said heat
- pipe with a non-interference fit;
- and
- disposing connective interface in said slot and between said fin group and said heat pipe to not only fasten the fin group and the heat pipe together but also increase thermal conductivity therebetween.
A thermal module comprising:
- a base;
- a heat pipe attached to said base;
- and
- a fin group attached to said heat pipe away from said base;
- wherein
- said fin group defines a slot to receive said heat pipe in a non-interference fit and a connective interface is disposed in the slot between said fin group and said heat pipe to not only grasp said fin group and said heat pipe together but also increase thermal conductivity therebetween.
Dependencies are inferred from the claim text.