Low dielectric constant material reinforcement for improved electromigration reliability

A reinforced interconnect structure, comprising:

• First, second and third metal interconnects, each of the first, second and third interconnects disposed in a mechanically compliant dielectric, each of the first, second and third interconnects have a line portion and a via portion, each of the line portions of the first, second and third interconnects having a top and a bottom, each of the first, second and third interconnects having an anode section and a cathode section, wherein the via portion of the second metal interconnect is in electrical communication with the line portion of the first metal interconnection and wherein the third interconnect is in electrical communication with the second interconnect;
• first and second reinforcements, each of the first and second reinforcements comprising a mechanically rigid material, the first reinforcement in contact with the via portion in the anode section of the second metal interconnect and the top of the line portion of the first interconnect, the second reinforcement in contact with the top of the line portion in the anode section of the second interconnect and the bottom of the line portion of third interconnect.

A reinforced interconnect structure, comprising:

• First, second and third metal interconnects, each of the first, second and third interconnects disposed in a mechanically compliant dielectric, each of the first, second and third interconnects have a line portion and a via portion, each of the line portions of the first, second and third interconnects having a top and a bottom, each of the first, second and third interconnects having an anode section and a cathode section, wherein the via portion of the second metal interconnect is in electrical communication with the line portion of the first metal interconnection and wherein the third interconnect is in electrical communication with the second interconnect;
• first and second reinforcements, each of the first and second reinforcements comprising a mechanically rigid material, the first reinforcement positioned in the dielectric between the first and second interconnects and the second reinforcement positioned in the dielectric between the second and the third interconnects.