Wafer-level package with silicon gasket
AssigneeAgilent Technologies, Inc.
InventorsFrank S. Geefay, Qing Gan, Ann Mattos, Domingo A. Figueredo
Life of this patent
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Abstract
A gasket encloses a hermetically sealed environment between a cap wafer and a base wafer. The gasket is bonded to the base wafer using bonding material. The bonding material can be one or more of many substances that exhibit acceptable adhesion, sealing, and other properties that ensure a hermetically sealed environment. The gasket is carved out from the cap wafer material itself. The cap wafer is typically made of extremely strong and rigid material such as silicon. Since the gasket is made from the cap wafer, the gasket itself is also extremely strong and rigid.
Claims24
A method for manufacturing a wafer-level package, comprising:
- providing a first wafer and a second wafer;
- removing a portion from the first wafer to form a gasket;
- forming a pad on the second wafer, the pad substantially matching the gasket;
- interposing bonding material between the gasket and the pad;
- and
- bonding the gasket to the pad with the bonding material to create a hermetically sealed environment between the first and second wafers.
A wafer-level package, comprising:
- a first wafer and a second wafer;
- a gasket formed from the first wafer;
- a pad on the second wafer, substantially matching the gasket;
- and
- bonding material joining the gasket and the pad.
A wafer-level package, comprising:
- a first wafer and a second wafer;
- a gasket formed from the first wafer;
- and
- bonding material joining the gasket and the second wafer.
Dependencies are inferred from the claim text.