Method of diffusing pressurized liquid
AssigneeMicron Technology, Inc.
InventorL. Brian Dunn
Life of this patent
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Abstract
The invention relates to a diffuser for wet processing systems involved in the manufacturing of semiconductor wafers. The diffuser includes a plenum section and a slitted section. Pressurized fluid from the plenum section is forced through the slitted section and across a plurality of wafers mounted in the wet processing system. One advantage is that by “diffusing” pressurized fluid through the slitted section, a generally uniform and/or laminar flow is achieved. Desirably, the diffuser provides a more reliable, and hence more cost-effective, technology for wet processing fabrication of semiconductor wafers.
Claims53
A method for diffusing fluid through a wafer processing system, comprising:
- pressurizing fluid;
- and
- forcing the fluid through a plate having a plurality of slits arranged in rows with a plurality of the rows having at least one central slit, the central slits of at least two rows having different lengths.
A method for wet processing of wafers, comprising:
- supporting one or more wafers in a tank;
- and
- diffusing pressurized fluid through a plate having a plurality of slits arranged in rows with a plurality of the rows having at least one central slit, the central slits of at least two rows having different lengths, whereby the fluid flows across the one or more wafers.
A method for diffusing fluid through a wafer processing system, comprising:
- pressurizing fluid;
- and
- forcing the fluid through a plate having a plurality of slits arranged in rows with a plurality of the rows having at least one end slit wherein at least two of the rows have end slits of different lengths.
A method for wet processing of wafers, comprising:
- supporting one or more wafers in a tank;
- and
- diffusing pressurized fluid through a plate having a plurality of slits arranged in rows with a plurality of the rows having at least one end slit, wherein at least two rows have end slits of different lengths.
A method of diffusing fluid through a wet semiconductor processing system comprising forcing fluid through a plate having a plurality of slots arranged in rows with a plurality of the rows having at least one central slot, the central slots of at least two rows having different lengths.
A method for wet processing of wafers comprising diffusing pressurized fluid through a plate having a plurality of slots arranged in rows with a plurality of the rows having at least one end slot, the end slots of at least two rows having different lengths.
Dependencies are inferred from the claim text.