Flex tab for use in stacking packaged integrated circuit chips

A connector for use in a chip stack including at least first and second stacked packaged chips which each comprise a package body having a plurality of leads extending therefrom, the connector comprising:

• a substrate fabricated from an insulating material;
• and
• a plurality of flex tabs attached to the substrate in spaced relation to each other, each of the flex tabs being fabricated from a conductive material;
• the flex tabs each being shaped to define a first portion which is electrically connectable to a respective one of the leads of the first packaged chip and an integral second portion which is electrically connectable to a corresponding one of the leads of the second packaged chip.

A chip stack comprising:

• a first packaged chip comprising a package body having a plurality of leads extending therefrom;
• a second packaged chip comprising a package body having a plurality of leads extending therefrom, the second packaged chip being stacked upon the first packaged chip such that the leads of the second packaged chip are aligned with respective ones of the leads of the first packaged chip;
• and
• a connector electrically connecting the first and second packaged chips to each other and comprising:
• a substrate fabricated from an insulating material;
• at least one flex tab attached to the substrate and fabricated from a conductive material;
• the flex tab being shaped to define a first portion which is electrically connected to one of the leads of the first packaged chip and an integral second portion which is electrically connected to a corresponding one of the leads of the second packaged chip.

A chip stack comprising:

• a first packaged chip comprising a package body having a plurality of leads extending therefrom;
• a second packaged chip comprising a package body having a plurality of leads extending therefrom, the second packaged chip being stacked upon the first packaged chip such that the leads of the second packaged chip are aligned with respective ones of the leads of the first packaged chip;
• and
• a connector electrically connecting the first and second packaged chips to each other and comprising:
• a substrate fabricated from an insulating material;
• and
• a plurality of flex tabs attached to the substrate in spaced relation to each other, each of the flex tabs being fabricated from a conductive material;
• the flex tabs each being shaped to define a first portion which is electrically connected to a respective one of the leads of the first packaged chip and an integral second portion which is electrically connected to a corresponding one of the leads of the second packaged chip.

A method for assembling a chip stack comprising at least first and second package chips which each include a package body having a plurality of leads extending therefrom, the method comprising the steps of:

• a) pre-assembling a connector comprising:
• a substrate fabricated from an insulating material;
• and
• a plurality of flex tabs attached to the substrate in spaced relation to each other, each of the flex tabs being fabricated from a conductive material and shaped to define a first portion and an integral second portion;
• b) aligning the first portions of the flex tabs with respective ones of the leads of the first packaged chip;
• c) electrically connecting the first portions of the flex tabs to respective ones of the leads of the first packaged chip;
• d) stacking the second packaged chip upon the first packaged chip such that the leads of the second packaged chip are aligned with respective ones of the first portions of the flex tabs;
• and
• e) electrically connecting the second portions of the flex tabs to respective ones of the leads of the second packaged chip.