Method of fabricating passive device on printed circuit board

A method of fabricating a passive device on a printed circuit board, comprising:

• providing a first substrate that comprises at least a first insulation core layer and a first conductive layer over the first insulation core layer;
• providing a second substrate that comprises at least a second insulation core layer and a second conductive layer over the second insulation core layer;
• coating a dielectric material over the first substrate to cover the first conductive layer to form an internal dielectric layer;
• and
• laminating the second substrate with the first substrate, with the first conductive layer and the second conductive layer sandwiching and adjacent to the internal dielectric layer.