Coating method and apparatus
AssigneeTokyo Electron Limited
InventorsShinichi Hayashi, Hirofumi Ookuma, Kouichi Suefuji
Life of this patent
Estimating the term…
Loading patent…
AssigneeTokyo Electron Limited
InventorsShinichi Hayashi, Hirofumi Ookuma, Kouichi Suefuji
Estimating the term…
A processing solution is supplied from processing-solution suppliers onto the surfaces of targets to be processed while a flow rate of the processing solution is being adjusted. The processing solution is fed from a processing-solution supply source at a specific pressure via a processing-solution pressure-up feeder. The pressure of the processing solution fed via the processing-solution pressure-up feeder is adjust to another specific pressure or more at least when the processing-solution suppliers are operating simultaneously. A flow-rate detector detects the flow rate of the processing solution supplied from each processing-solution supplier. A pressure detector detects the pressure of the processing solution fed via the processing-solution pressure-up feeder. The flow-rate adjuster and the pressure adjuster are controlled based on prestored control data and detection signals from the flow-rate detector and the pressure detector so that the same amount of processing solution is supplied to the targets from the processing-solution suppliers.
A coating method comprising the steps of:
A coating method comprising the steps of:
A coating apparatus comprising:
A coating apparatus comprising:
A processing-solution supplying method comprising the steps of:
Dependencies are inferred from the claim text.