Layered circuit boards and methods of production thereof

Abstract

Compositions and methods are provided whereby electronic layered components or stacks may be produced that comprise a) a substrate layer; b) an electronic component; and c) an electromagnetic interference shielding component, wherein the component comprises a first insulating layer, an electrically conductive layer, and a second insulating layer. The layered component or stack comprising an electronic component and an electromagnetic interference shielding component may be produced by: a) providing a substrate layer, wherein the substrate layer comprises at least one layer of material; b) coupling an electronic component to the substrate layer; c) applying a conformal electromagnetic interference shielding component to the substrate layer, wherein applying the step of an electromagnetic interference shielding component further comprises: 1) applying a first insulating layer to the electronic component; 2) patterning the first insulating layer; 3) applying an electrically conductive layer to the patterned first insulating layer; 4) applying a second insulating layer to the electrically conductive layer; and 5) curing the shielding component.

Dependencies are inferred from the claim text.