Structure and designing method of composite heat-dissipating structure

A method of designing a composite heat-dissipating structure disposed on a circuit board for a heat-generating device, wherein said structure includes a first heat-dissipating element connected to a heat-generating device and a second heat-dissipating element connected to said first heat-dissipating element, comprising steps of:

• (a) computing a heat generated by said heat-generating device;
• (b) choosing said first heat-dissipating element from one of existing and available heat-dissipating thermal conductive plates which has a space for said heat-generating device being mounted on said first heat-dissipating element and could dissipate said heat generated by said heat-generating device to said second beat-dissipating element through heat conduction;
• (c) choosing said second heat-dissipating element from one of existing and available heat-dissipating thermal conductive plates such that said first heat-dissipating element could be mounted on said second heat-dissipating element and said second heat-dissipating element could be mounted on said circuit board, is chosen among many so as to dissipate a highest amount of said heat generated by said heat-generating device from said second heat-dissipating element to an air through heat convection, and could dissipate a remaining part of heat generated by said heat-generating device to a third heat-dissipating element through heat conduction;
• and
• (d) choosing said second heat-dissipating element from one of portions of existing and available heat-dissipating thermal conductive plates such that said first heat-dissipating element could be mounted on said second heat-dissipating element and said second heat-dissipating element could be mounted on said circuit board, is chosen among many so as to dissipate a highest amount of said heat generated by said heat-generating device from said second heat-dissipating element to said air through heat convection, and could dissipate a remaining part of heat generated by said heat-generating device to said third heat-dissipating element through heat conduction when no solution has been found from said step (c).

A heat-dissipating system comprising a plurality of composite heat-dissipating structures wherein each said composite heat-dissipating structure comprising:

• a first heat-dissipating element detachably connected to a heat-generating device;
• a second heat-dissipating element detachably connected to said first heat-dissipating element, wherein each said second heat-dissipating element is mounted on a circuit board and is in parallel with said second heat-dissipating elements of said plurality of structures mounted on said circuit board;
• a third heat-dissipating element detachably connected to said second heat-dissipating element;
• and
• a fourth heat-dissipating element integrally connected to said first heat-dissipating element.