Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
AssigneeMicron Technology, Inc.
InventorsDerek J. Gochnour, Leonard E. Mess
Life of this patent
Estimating the term…
Abstract
A method and apparatus for preventing board warpage during the application and curing or drying of liquid epoxies, or the like, on printed circuit boards using a clamping fixture assembly, which includes at least one clamping fixture support and at least one clamping fixture overlay. If desired, a plurality of printed circuit boards may be processed using an appropriate clamping fixture assembly. Furthermore, the clamping fixture may be constructed so a slight bow or curvature thereof can counter either a convex or concave bow or curvature of the printed circuit board.
Claims11
A method of applying a material on a printed circuit board, comprising:
- providing a base having a surface having a radius of curvature including one of a convex radius of curvature and a concave radius of curvature for mounting said printed circuit board thereon, said base having at least one aperture therein;
- providing at least two clamping elements for use with the base;
- providing at least two retaining elements for use with the base and the at least two clamping elements;
- placing said printed circuit board on the base;
- engaging at least two edges of said printed circuit board with a portion of a clamping element of said at least two clamping elements;
- conforming said printed circuit board to the surface of the base, said printed circuit board having a radius of curvature including one of a convex radius of curvature and a concave radius of curvature of at least a portion thereof as a result of conforming to the surface of the base, the radius of curvature of the base opposite the radius of curvature of said printed circuit board;
- securing said at least two retaining elements to the base;
- applying a material to said base;
- and
- curing said applied material.
A method for applying a material located on a portion of a printed circuit board comprising:
- providing a base having a surface having a radius of curvature including one of a convex radius of curvature and a concave radius of curvature for mounting said printed circuit board thereon;
- providing clamping elements for engaging at least a portion of an edge of said printed circuit board, each of the clamping elements integrally attached to the base;
- mounting at least one clamping element of the clamping elements along said edge of said printed circuit board;
- conforming said printed circuit board to the surface of said base, said printed circuit board having a radius of curvature including one of a convex radius of curvature and a concave radius of curvature when conformed to the surface of said base, the radius of curvature of the base opposite to the radius of curvature of said printed circuit board;
- applying a material to said printed circuit board;
- and
- curing said applied material.
A method for curing a sealing material on a printed circuit board comprising:
- providing a base having a surface having a radius of curvature including one of a convex radius of curvature and a concave radius of curvature for mounting said printed circuit board thereon;
- providing a clamping element for engaging at least a portion of a surface of said printed circuit board;
- providing at least one retaining element for securing said clamping element to said base during curing of a sealing material;
- conforming said printed circuit board to the surface of said base, said printed circuit board having a radius of curvature including one of a convex radius of curvature and a concave radius of curvature of at least a portion thereof, the radius of curvature of the base opposite to the radius of curvature of said printed circuit board;
- applying a sealing material to said printed circuit board;
- curing said sealing material;
- and
- removing said printed circuit board from the base;.
Dependencies are inferred from the claim text.