Fuse structure integrated wire bonding on the low k interconnect and method for making the same
AssigneeUnited Microelectronics Corp.
InventorKun-Chih Wang
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Abstract
A structure for using fuse structure integrated wire bonding on the substrate, and relates to methods for making the same are disclosed, in which an Al-fuse has an extra-etching process pattern by fuse-open mask and has been thinned down from Al-fuse thickness. The Al fuse structure integrated Al wire-bonding pad has two kind of thickness under fuse-open and for the other area. This invention makes the fuse easy to blow without suffering any bondability from wire bonding for packaging.
Claims23
A fuse structure integrated wire bonding on a substrate, said structure comprising:
- a first metal layer on a first portion of said substrate;
- a second metal layer on a second portion of said substrate, wherein said second metal layer has a concavity therein;
- and
- a passivation layer on said first metal layer and said second metal layer, wherein said passivation layer has a first opening over said first metal layer and has a second opening substantially over said concavity of said second metal layer.
A method for forming a fuse-open pattern on a substrate of the type having a first metal layer formed on a first portion of said substrate, a second metal layer formed on a second portion of said substrate, a passivation layer formed on said first metal layer and said second metal layer, wherein said passivation layer has a first opening over said first metal layer and has a second opening over said second metal layer, wherein the improvement comprises:
- removing a portion of said second metal layer to form a concavity in said second metal layer, wherein said second opening is substantially over said concavity.
A method for forming a fuse structure integrated a wire bonding on a low k interconnect substrate, said method comprising:
- forming a cap layer on said low k interconnect substrate;
- forming a metal layer on said cap layer;
- removing a portion of said metal layer to form a concavity in said metal layer to define a fuse-open pattern;
- removing a portion of said metal layer to define a pad pattern and a fuse pattern on said substrate, wherein said fuse pattern have said fuse-open pattern on the top of said fuse pattern;
- forming a conformal passivation layer on said cap layer, said pad pattern, and said fuse pattern;
- and
- removing a portion of said conformal passivation layer to form a first opening in said pad pattern and a second opening in said fuse pattern, wherein said second opening is substantially over said concavity.
Dependencies are inferred from the claim text.