US 2003/0110658 A1 · Apparatus for monitoring a semiconductor wafer during a spin drying operation

Abstract

An apparatus for spin drying a semiconductor wafer includes a hollow core spindle and a chuck assembly having grippers for supporting a wafer at an edge thereof. A sleeve is disposed in the central opening of the spindle and a manifold is disposed in the upper end of the sleeve. A capacitance sensor is affixed to the manifold. In another apparatus, an arm having a capacitance sensor mounted thereon is positioned such that the capacitance sensor is disposed above a space to be occupied by a wafer that is supported by the grippers. Yet another apparatus includes an arm having a light source and a detector mounted thereon. The light source directs light toward a surface of a wafer such that light that reflects off of the surface is substantially perpendicular to that surface. The detector is positioned to measure the intensity of the reflected light.

Claims14

Dependent claims

An apparatus for spin drying a semiconductor wafer, comprising:

a hollow core spindle having a central opening therethrough;
a chuck assembly mounted on the spindle, the chuck assembly having a central opening therethrough and including grippers for supporting a semiconductor wafer at an edge thereof;
a sleeve disposed in the central opening of the hollow core spindle, the sleeve being disposed such that an upper end thereof extends through the central opening of the chuck assembly;
a manifold disposed in the upper end of the sleeve;
and
a capacitance sensor affixed to the manifold, the capacitance sensor being configured to measure a capacitance value between the semiconductor wafer and the capacitance sensor.

3 more elements

Dependencies are inferred from the claim text.

Apparatus for monitoring a semiconductor wafer during a spin drying operation

Life of this patent

Apparatus for monitoring a semiconductor wafer during a spin drying operation

Life of this patent

Abstract

Claims14