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AssigneeZeon Corporation
InventorsKazuyuki Onishi, Toshiyasu Matsui, Hiroshi Kurakata, Masahiko Sugimura
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This invention provides a material for a multi-layer circuit board, excellent in insulating property and burying properties and free from occurrence of cracks, a production method, and a multi-layer circuit board using the insulating material. The invention provides an insulating material having a curable composition layer wherein the curable composition layer contains 0 to 50 pieces/cm2 of foreign matter having particle sizes falling within a range of 30 to 50 μm, a production method, and a production method for a multi-layer circuit board using the insulating material.
An insulating material comprising a support and a curable composition layer laminated on said support, wherein said curable composition layer has a content of foreign matter, having particle sizes within the range of 30 to 50 μm, of 0 to 50 pieces per square centimeter.
An insulating material including a support and a layer of a curable composition laminated on said support, and having a charged voltage (absolute value) of not higher than 500 V.
Dependencies are inferred from the claim text.