Circuit routing for printhead having increased corrosion resistance
AssigneeHewlett-Packard Development Company, L.P.
InventorsWilliam B. Connors, Terry E. McMahon, Donald W. Schulte, Keith Moore
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Abstract
The present invention includes as one embodiment a printhead having a circuit with plural resistors and a power bus. The printhead includes a metal stack formed within the circuit, which is comprised of a first metal layer and a second metal layer and at least one power via. The power via is formed within the circuit as an interface between the first metal layer and the second metal layer and acts as a corrosion separation barrier between of the resistors and the power bus.
Claims20
A printhead having a circuit with plural resistors and a power bus, comprising:
- a metal stack formed within the circuit and comprised of a first metal layer and a second metal layer;
- and
- at least one power via formed within the circuit as an interface between the first metal layer and the second metal layer and as a separation barrier between the resistors and the power bus.
In an ink jet printhead, a method for increasing resistance to ink corrosion of a thin film circuit, comprising:
- separating a thin film resistor from a power bus in the thin film circuit;
- and
- protecting the power bus from ink exposure.
A method of manufacturing a circuit for an ink jet printhead, the circuit having plural resistors, a power bus and a controller bus, the method comprising:
- routing a conductive route from the power bus to power vias associated with each resistor and to each resistor and from the controller bus to controller vias associated with each resistor and to each resistor;
- and
- protecting the power bus from ink penetration with the power vias for increasing resistance to corrosion.
Dependencies are inferred from the claim text.