Back to results
US 2003/0081058 A1Published application
Joining of different materials of carrier for printhead dies
AssigneeHewlett-Packard Development Company, L.P.
InventorsDavid K. McElfresh, Mohammad Akhavain, Joseph E. Scheffelin, Gerald V. Rapp, Janis Horvath
Life of this patent
Estimating the term…
Abstract
A printhead assembly includes a carrier including a substrate and a substructure, and a plurality of printhead dies each mounted on the substrate of the carrier. The substrate includes a first material and the substructure is formed of a second material. As such, the substrate and the substructure are joined by a lap joint.
Claims42
A printhead assembly, comprising:
- a carrier including a substrate including a first material and a substructure formed of a second material, wherein the substrate and the substructure are joined by a lap joint;
- and
- a plurality of printhead dies each mounted on the substrate of the carrier.
A method of forming a printhead assembly, the method comprising:
- providing a substrate including a first material and having a first side and a second side opposite the first side;
- mounting a plurality of printhead dies on the first side of the substrate;
- and
- joining a substructure formed of a second material to the second side of the substrate with a lap joint.
1 more element
A carrier adapted to receive a plurality of printhead dies, the carrier comprising:
- a substrate including a first material and having a first side adapted to receive the printhead dies and a second side opposite the first side;
- and
- a substructure formed of a second material and joined to the second side of the substrate with a lap joint.
Dependencies are inferred from the claim text.