Flip chip integrated package mount support
AssigneeMicron Technology, Inc.
InventorTodd O. Bolken
Life of this patent
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Abstract
A flip chip integrated package is described as including a chip encapsulated with a mold compound and mounted on a substrate. In one embodiment, the mold compound surrounds the chip, filling in space between the chip and the substrate. The substrate includes a plurality of openings through which the mold compound extrudes, forming molded buttons. In another embodiment, the substrate includes more numerous openings of a smaller diameter, which allow the mold compound to extrude through and create a molded rib. The molded buttons and the molded rib serve as a mount support feature. The substrate includes vents to allow trapped gas to be expelled from the package.
Claims24
A flip chip integrated package, comprising:
- a substrate having a first and a second surface and a plurality of openings extending from said first to said second surfaces;
- a chip mounted on said first surface of said substrate over said openings;
- and
- a mold compound encapsulating said chip and adhering to said first surface of said substrate, wherein said mold compound further fills in space between the chip and the first surface of the substrate and extends through said openings to create molded buttons projecting from said second surface of said substrate.
A flip chip integrated package, comprising:
- a substrate having a first and a second surface and a plurality of openings extending from said first to said second surfaces;
- a chip mounted on said first surface of said substrate over said openings;
- and
- a mold compound encapsulating said chip and adhering to said first surface of said substrate, wherein said mold compound further fills in space between the chip and the first surface of the substrate and extends through said openings to create a molded rib.
A method of forming a flip chip integrated package, comprising:
- mounting a chip on a substrate, the substrate having a first and a second surface and a plurality of openings extending from the first to the second surfaces;
- and
- encapsulating the chip with a mold compound, wherein the mold compound fills in a space between the chip and the substrate and extrudes through the openings and extends from the second surface.
Dependencies are inferred from the claim text.