Semiconductor device
AssigneesMitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering Corporation
InventorsTakeru Matsuoka, Shoichi Fukui, Takeshi Masamitsu
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AssigneesMitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering Corporation
InventorsTakeru Matsuoka, Shoichi Fukui, Takeshi Masamitsu
Estimating the term…
A plurality of MOS type FET devices 14 and 16 are provided on a semiconductor substrate 12. A lower interlayer insulating film 20 is provided thereon. Each of through holes 22, which extends from each of gate electrodes 14c of the plural FET devices via source/drain regions 14b and 16a, is defined in the lower interlayer insulating film 20. A local wiring 24 is buried in the through hole 22 to connect each gate electrode 14c and the source/drain regions 14b and 16a. Further, an upper interlayer insulating film 26 is provided on the local wiring 24 and the lower interlayer insulating film 20. Upper electrode layers 28 are placed on the surface of the upper interlayer insulating film 26.
A semiconductor device comprising:
Dependencies are inferred from the claim text.