Back to results
US 2003/0077940 A1Published application
Housing device and contact element to be used in the housing device
AssigneeEUPEC Europaeische Gesellschaft fuer Leistungshalbleiter mbH & Co. KG
InventorManfred Loddenkoetter
Life of this patent
Estimating the term…
Abstract
To increase the flexibility of a housing device that is used to accommodate a circuit configuration, areas of the housing configured to receive contact elements in a variety of positions are configured such that the contact elements can be disposed and oriented in a plurality of ways when disposed in each position.
Claims29
A housing device for accommodating at least one power semiconductor module, comprising:
- housing areas:
- having live contact elements with at least one attachment area;
- each having a number of contact element configuration positions substantially linear in one extent direction for placing said contact elements in a number of orientations;
- each being formed from an alternating sequence of apertures and web elements;
- and
- each being disposed in approximately one accommodating plane in said extent direction and being substantially mirror-image symmetrical with respect to said accommodating plane, said accommodating plane containing said extent direction;
- and
- said web elements each:
- being substantially mirror-image symmetrical;
- having an approximately double-T-shaped support;
- and
- having at least one groove at least one of interlocking and force-fitting said attachment area of said contact elements.
9 more elements
Dependencies are inferred from the claim text.