Semiconductor fabricating method

A method of fabricating a semiconductor comprising the steps of:

• (a) mounting on a first processing apparatus a first container accommodating a predetermined number of semiconductor wafers and labeled with a first identifier and a second container labeled with a second identifier, and storing said first and second identifiers;
• (b) loading, while said first processing apparatus is submitting said semiconductor wafers to a first process, designated ones of said processed semiconductor wafers by submission to said first process, into said second container as sample wafers;
• (c) mounting said second container on an inspection apparatus to inspect said sample wafers;
• (d) mounting on a second processing apparatus said first container accommodating a rest of said processed semiconductor wafers by submission to said first process and said second container accommodating said inspected sample wafers, after said inspected sample wafers are judged to be acceptable, and identifying said first and second containers mounted on said second processing apparatus by comparison of identifiers thereof with said stored first and second identifiers, respectively;
• and
• (e) causing said second processing apparatus to submit said rest of said processed semiconductor wafers by submission to said first process and said inspected sample wafers to a second process, and returning said processed sample wafers by submission to said second process to said first container.