Semiconductor device and tape carrier, and method of manufacturing the same, circuit board, electronic instrument, and tape carrier manufacturing device

A method of manufacturing a semiconductor device comprising:

• an examination step in which a tape carrier having a plurality of bonding portions formed in a matrix form and at least two types of identification marks is examined;
• a step of removing a portion which includes a defective location detected in said examination step, and then joining together remaining portions of said tape carrier after the removal;
• a step of forming a join mark delimiting a matrix in which a join formed in said joining step is positioned;
• and
• a step of electrically connecting each of said plurality of bonding portions to a corresponding of a plurality of semiconductor chips, excluding a region delimited by said join mark.

A tape carrier manufacturing device, comprising:

• carrying means for carrying a tape carrier having a plurality of identification marks;
• and
• a plurality of detection means for detecting said plurality of identification marks,
• wherein said plurality of detection means are detection devices detecting said identification marks by different detection methods.