Electronic devices with semiconductor chips and a leadframe with device positions and methods for producing the same

An electronic device comprising:

• a chip island having contact pads and a coplanar pattern;
• an inner flat conductor section having a contact pad;
• a semiconductor chip having a top side and a rear side, said rear side disposed on said chip island, and said top side having contact areas electrically connected to said contact pad contact pads;
• said coplanar pattern including electrically conductive contact terminal regions alternating with insulating adhesion layer regions at least in a region of said chip island being covered by said semiconductor chip.

A leadframe comprising:

• a chip island for a semiconductor chip and having a coplanar pattern of adhesion layer regions alternating with contact layer regions;
• inner flat conductor sections;
• a plurality of device positions for electronic devices and configured in one of a matrix form and an inline form, each of said device positions having a leadframe frame;
• a respective web for each of said device positions held by said leadframe frame and extending from said leadframe frame toward said chip island;
• and
• a further respective web for each of said device positions extending from said leadframe frame to said inner flat conductor sections.

A preliminary product for production of an electronic device, the product comprising:

• a leadframe including:
• a chip island for a semiconductor chip and having a coplanar pattern of adhesion layer regions alternating with contact layer regions;
• inner flat conductor sections;
• a plurality of device positions for electronic devices and configured in one of a matrix form and an inline form, each of said device positions having a leadframe frame;
• a respective web for each of said device positions held by said leadframe frame and extending from said leadframe frame toward said chip island;
• and
• a further respective web for each of said device positions extending from said leadframe frame to said inner flat conductor sections.

A method for producing a leadframe for electronic devices, which comprises:

• structuring a raw strip having a metal surface to form the leadframe by forming a perforation in the raw strip, disposing structures in a configuration according to position of devices, and adding a chip island and outer and inner flat conductor sections;
• coating the chip island and the inner flat conductor sections with material for contact layer regions;
• and
• selectively applying an adhesion layer to adhesion layer regions of the chip island and the inner flat conductor sections of the leadframe structures in the device positions while not coating the contact layer regions formed in a coplanar pattern.

A method for producing an electronic device with a coplanar pattern of electrically conductive contact area regions alternating with insulating adhesion layer regions on a chip island, the method which comprises:

• providing a leadframe including a plurality of device positions and a coplanar pattern having contact layer regions and adhesion layer regions on the chip island and on inner flat conductor sections;
• applying semiconductor chips to the chip islands with the adhesion layer regions and the contact layer regions of the leadframe;
• connecting contact areas of the semiconductor chips to the contact layer regions via a connecting line, insofar as the contact layer regions are not covered by the semiconductor chip;
• and
• encapsulating the chip island, the inner flat conductor sections, the connecting lines, and the semiconductor chip on one side with a plastic molding compound to form a plastic housing having on a housing underside outer flat conductor sections and an underside of the chip island as external contacts.