Mechanical support system for a thin package
AssigneeIntel Corporation
InventorChris Baldwin
Life of this patent
Estimating the term…
Abstract
An electronic package includes an IC, such as a die, mounted onto one side of a thin interposer and a pin carrier mounted to an opposing side of the interposer. The pin carrier includes a cavity underneath the die. The cavity allows capacitors, or other electronic components, to be mounted against the interposer beneath the die. The cavity in the pin carrier is filled with an encapsulant to mechanically support the thin interposer in the area of the cavity during operation of an electronic system that includes the package.
Claims20
A method of fabricating an electronics package, the method comprising:
- securing a die to one side of a interposer;
- securing a pin carrier to an opposing side of the interposer, the pin carrier including a cavity positioned against the interposer opposite to the die;
- securing an electronic component to the interposer such that the electronic component is positioned within the cavity in the pin carrier;
- at least partially filling the cavity in the pin carrier with an encapsulant sufficient to provide mechanical support to the interposer.
An electronic package comprising:
- an interposer having an upper surface and a lower surface;
- a die secured to the upper surface of the interposer;
- a pin carrier having a cavity, the pin carrier being secured to the lower surface of the interposer such that the cavity is against the interposer opposite to the die;
- an electronic component secured to the lower surface of the interposer, the electronic component being positioned within the cavity in the pin carrier;
- and
- an encapsulant at least partially filling the cavity to mechanically support the interposer during mechanical loading the package.
A data processing system comprising:
- a bus;
- a memory coupled to the bus;
- a processor;
- and
- a package including an interposer, a pin carrier and an electronic component, the processor being secured to one side of the interposer and the pin carrier being secured to other side of the interposer, the pin carrier electrically connecting the processor to the bus and including a cavity that is against the interposer opposite to the processor, the electronic component being secured to the interposer within the cavity in the pin carrier, the package further including an encapsulant that at least partially fills the cavity in the pin carrier to mechanically support the interposer during operation of the data processing system.
An electronic package comprising:
- an interposer;
- a die secured to the interposer;
- a pin carrier secured to the interposer, the pin carrier including a cavity opposite to the die;
- an electronic component secured to the interposer within the cavity;
- and
- an encapsulant at least partially filling the cavity.
Dependencies are inferred from the claim text.