Semiconductor wafer cassette
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsYu-Pin Tsai, Chih-Min Pao, Ching-Feng Tseng, Fu-Tang Chu
Life of this patent
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Abstract
The present invention discloses a semiconductor wafer cassette, which is able to receive at least one wafer, comprising: a first side wall, a second side wall opposite to the first side wall, a front surface, and a back surface opposite to the front surface; the cassette further comprising a body, the body defining an internal bay portion with slots for vertically receiving a plurality of wafers, each slot of the internal bay portion having one support slab. Moreover, the body also includes two parallel legs for supporting the cassette and a handle for handling the wafer cassette.
Claims10
A semiconductor wafer cassette, which is able to receive at least one wafer, comprising:
- a first side wall;
- a second side wall opposite to the first side wall;
- a front surface, connected between the first side wall and the second side wall;
- a back surface, connected between the first side wall and the second side wall and opposite to the front surface;
- and
- a body defined by the first side wall, the second side wall, the front surface, and the back surface, including:
- an internal bay portion having a plurality of slots constructed by alignment grooves on the inner surface of the first side wall and the second side wall and support slabs displaced across the alignment grooves, wherein the support slabs extend between the first side wall and the second side wall, and each slot is able to receive one wafer;
- two legs parallel to each other;
- and
- a handle displaced on the front surface for handling the semiconductor wafer cassette.
A semiconductor wafer cassette, which is able to receive at least one wafer, comprising:
- a first side wall;
- a second side wall opposite to the first side wall;
- a front surface, connected between the first side wall and the second side wall;
- a back surface, connected between the first side wall and the second side wall and opposite to the front surface;
- an internal bay portion having a plurality of slots, and the width of each slot is more than 7 mm;
- two legs parallel to each other;
- and
- a handle displaced on the front surface for handling the semiconductor wafer cassette.
A semiconductor wafer cassette, which is able to receive at least one wafer, comprising:
- a first side wall;
- a second side wall opposite to the first side wall;
- a front surface, connected between the first side wall and the second side wall;
- a back surface, connected between the first side wall and the second side wall and opposite to the front surface;
- and
- a body defined by the first side wall, the second side wall, the front surface, and the back surface, including:
- an internal bay portion having a plurality of slots constructed by alignment grooves on the inner surface of the first side wall and the second side wall and support slabs displaced across the alignment grooves, wherein the support slabs extend between the first side wall and the second side wall, and the width of each slot is more than 7 mm;
- two legs parallel to each other;
- and
- a handle displaced on the front surface for handling the semiconductor wafer cassette.
Dependencies are inferred from the claim text.