Method for controlling field flow decouple plating and a device thereof

An apparatus of field flow decouple plating, comprising:

• a high voltage direct current power source for a driving field with electrical swimming, providing a first positive pole and a first negative pole;
• a low voltage plating direct current power source, providing a second positive pole and a second negative pole;
• plating solution, containing a driving positive pole and a driving negative pole for electrical swimming and the driving positive pole spacing apart from the driving negative pole, a driving positive pole and a driving negative pole for electric swimming, and a metal ionic positive pole and an extraction negative pole;
• wherein, the first positive and first negative poles are connected to the driving positive pole and the driving negative pole respectively, the second positive pole is connected to the metal ionic positive pole and the second negative pole to the extraction negative pole, and the metal ionic positive pole and the extraction negative pole are disposed to oppose to the driving positive pole and the driving negative pole for electrical swimming respectively.