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US 2003/0075306 A1Published application
Thermal control layer in miniature LHP/CPL wicks
OwnerJon Zuo, Dmitry Khrustalev +1inventors
InventorsJon Zuo, Dmitry Khrustalev, Alfred L. Phillips
Life of this patent
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Abstract
A LHP/CPL wick includes an unconsolidated wick portion positioned within a first consolidated wick portion and a second consolidated wick portion. This wick provides a large ΔT across the wick, and sufficient capillary action for miniature LHP/CPL applications. Furthermore, the unconsolidated wick portion allows accommodation of mismatched coefficients of thermal expansion. A LHP/CPL having this wick is particularly applicable to silicon cooling devices.
Claims16
A wick comprising an unconsolidated wick portion positioned within a consolidated wick portion.
A heat pipe comprising:
- an evaporator section;
- a condenser section;
- a vapor channel interconnecting said evaporator section and said condenser section in fluid communication;
- a liquid channel interconnecting said evaporator section and said condenser section in fluid communication;
- and
- a wick positioned between said liquid channel and said vapor channel, said wick comprising an unconsolidated wick portion positioned between a first consolidated wick portion and a second consolidated wick portion, wherein said first consolidated wick portion is positioned adjacent to said vapor channel and said second consolidated wick portion is positioned adjacent to said liquid channel.
3 more elements
Dependencies are inferred from the claim text.