Multilayered diffusion barrier structure for improving adhesion property

A method to form a multilayered diffusion barrier structure on an underlayer for improving adhesion between the underlayer and a subsequently deposited conducting layer while maintain electrical conduction to the subsequently deposited conducting layer, the method comprises the steps of:

• a) Depositing a conducting diffusion barrier layer on the underlayer, whereby this diffusion barrier layer serves as a barrier between the underlayer and the subsequently deposited layer;
• b) Forming a poorly electrical conducting adhesion-promoter layer on top of the conducting diffusion barrier layer, whereby this adhesion-promoter layer serves to improve the adhesion of the multilayered diffusion barrier structure to the subsequently deposited layer;
• c) Removing the adhesion-promoter layer at selected predetermined locations to increase the electrical conduction to the subsequently deposited layer.

A multilayered diffusion barrier structure on a step underlayer for improving adhesion between the underlayer and a subsequently deposited conducting layer while maintain electrical conduction to the subsequently deposited conducting layer, the multilayered diffusion barrier structure comprises:

• a) A conducting diffusion barrier layer, whereby this diffusion barrier layer serves as a barrier between the underlayer and the subsequently deposited layer;
• b) A poorly electrical conducting adhesion-promoter layer on the conducting diffusion barrier layer on the sidewall of the step of the underlayer, whereby this adhesion-promoter layer serves to improve the adhesion of the multilayered diffusion barrier structure to the subsequently deposited layer and not to reduce the electrical conduction to the subsequently deposited layer.