Module card and a method for manufacturing the same
AssigneeKingpak Technology Inc.
InventorsMon Nan Ho, Hsiu Wen Tu, Kuo Feng Feng, Yung Sheng Chiu, Joe Liu, Nai Hua Yeh, Wen Chuan Chen, Allis Chen
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Abstract
A manufacturing method of a module card comprises steps of: providing a base board having a golden finger; mounting a chip on the base board for electrically connecting to the golden finger; and forming a packing layer on the chip for forming the module card. A module card comprises: a base board; a chip mounting on a surface of the base board; a golden finger on the board and electrically connecting to the chip; and a packing layer forming on the chip for covering the chip.
Claims10
A manufacturing method of a module card comprising steps of:
- providing a base board having a golden finger;
- mounting a chip on said base board for electrically connecting to said golden finger;
- and
- forming a packing layer on said chip for forming said module card.
A module card comprising:
- a base board;
- a chip mounting on a surface of said base board;
- a golden finger on said board and electrically connecting to said chip;
- and
- a packing layer forming on said chip for covering said chip.
Dependencies are inferred from the claim text.