Printed circuit board having permanent solder mask
AssigneeS & S Technology Corporation
InventorsChong-Ren Maa, Wan-Kuo Chih, Ming-Sung Tsai
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AssigneeS & S Technology Corporation
InventorsChong-Ren Maa, Wan-Kuo Chih, Ming-Sung Tsai
Estimating the term…
A printed circuit board having a permanent solder mask includes a substrate made of a glassfiber reinforced epoxy resin material. The top and bottom surfaces of the substrate are disposed thereon a conductive pattern respectively. An epoxy resin solder mask is coated on each surface of the substrate in such a way that the conductive pattern is divided into a sheltered portion covered by the solder mask and an unsheltered portion exposed outside. The solder mask also has an even and smooth outer surface with a micro-roughness ranging between 0.5 μm˜10 μm and an optimum thickness ranging between 2 μm˜200 μm.
A printed circuit board having a permanent solder mask comprising:
A printed circuit board having a permanent solder mask comprising:
Dependencies are inferred from the claim text.