Polymeric polishing pad having continuously regenerated work surface

The polishing pad as recited in claim. 1, and further comprising:

• the dissolvable substance being dissolvable upon contact with a polishing slurry.

A polishing pad, comprising:

• a polymeric matrix and dissolvable microelements for polishing a semiconductor device.

A method of polishing a semiconductor device, comprising the steps of:

• polishing the semiconductor device with a polishing slurry and a polishing pad comprising, a polymeric matrix and a dissolvable substance located, both at a work surface of the polishing pad, and in a subsurface proximate the work surface, and
• dissolving the dissolvable substance at the work surface in the polishing slurry while polishing the semiconductor device, and
• wearing away the polishing pad while polishing the semiconductor device such that the subsurface becomes the work surface that polishes the semiconductor device.

A method of making a polishing pad for polishing a semiconductor device, comprising the steps of:

• mixing a dissolvable substance and a polymeric matrix while the polymeric matrix is of relatively low viscosity,
• increasing the viscosity to provide a polishing pad comprising, a work surface of the polishing pad and a subsurface proximate the work surface, and
• providing the dissolvable substance at the work surface for dissolution in a polishing slurry.