Hermetically sealed package

A method for forming a hermetically sealed package, where the package includes a base on which is to be mounted an electronic device having a multiplicity of input and output points to be connected to an external system and wherein the package includes sidewalls mounted on the base and forming an enclosure surrounding the electronic device, with leads extending from within the package enclosure to outside the package for connecting the electronic device to the external system, comprising the steps of:

• mounting a ceramic insert on the inside of at least one of the side walls, said ceramic insert having a first set of terminals for the direct connection thereto of selected ones of said leads, said ceramic insert having a second set of terminals for directly connecting the second set of terminals to the electronic device;
• and said ceramic insert having a customized conductive pattern for interconnecting selected ones of the first and second set of terminals;
• connecting selected ones of the leads to selected ones of the first set of terminals;
• and
• connecting selected ones of the input and output points of the electronic device to selected ones of the second set of terminals.

A method for forming a hermetically sealed package, where the package includes a base on which is to be mounted an electronic device having a multiplicity of input and output points to be connected to an external system and wherein the package includes sidewalls mounted on the base and surrounding the electronic device, with leads extending from within the package to outside the package for connecting the electronic device to the external system comprising the steps of:

• mounting conductive leads in hermetically sealed openings in the sidewalls, with the conductive leads extending externally to and internally to the enclosure;
• mounting a ceramic insert on the inside of at least one of the side walls, said ceramic insert having a first set of terminals for the direct connection thereto of selected ones of said leads, said ceramic insert having a second set of terminals for the direct connection of the second set of terminals to the electronic device;
• and said ceramic insert having a unique conductive pattern interconnecting the first and second set of terminals;
• connecting selected ones of the leads to selected ones of the first set of terminals;
• and
• connecting selected ones of the input and output points of the electronic device to selected ones of the second set of terminals.

A hermetically sealed package comprising:

• a base plate for holding an electronic device having a multiplicity of input and output points;
• a plurality of side walls mounted on the base plate having a plurality of glass sealed openings through which leads extend from within the package to outside the package, the leads for connecting the electronic device to an external system;
• and
• an insert for coupling selected leads to selected input and output points of the electronic device, said insert being mounted on the inside of at least one of the side walls, said insert having a first set of terminals for the direct connection thereto of selected leads, said insert also having a second set of terminals arranged for optimizing the connection of selected ones of the second set of terminals to selected input and output points of the electronic device;
• and
• said insert having a customized conductive pattern for interconnecting selected ones of the first and second set of terminals.