Laminate
AssigneeMatsushita Electric Works, Ltd.
InventorsNaoto Ikegawa, Naoyuki Kondo, Kimiaki Nakata
Life of this patent
Estimating the term…
Abstract
A laminate includes a metal layer which is formed on and covers a surface of an insulating substrate activated by a plasma treatment by any method selected from a sputtering method, a vacuum depositing method and an ion plating method. The substrate is obtained by molding a resin composition containing 20 to 150 parts by mass of a fibrous filler having an average fiber diameter of 0.1 to 5 μm and an average fiber length of 10 to 50 μm relative to 100 parts by mass of a base resin comprising a thermoplastic resin and a thermosetting resin.
Claims15
A laminate comprising a metal layer which is formed on and covers the surface of an insulating substrate activated by the plasma treatment by any method selected from a sputtering method, a vacuum depositing method and an ion plating method, wherein the substrate is obtained by molding a resin composition containing 20 to 150 parts by mass of a fibrous filler having an average fiber diameter of 0.1 to 5 μm and an average fiber length of 10 to 50 μm relative to 100 parts by mass of a base resin comprising a thermoplastic resin and a thermosetting resin.
Dependencies are inferred from the claim text.