Contact type image sensor
AssigneeNEC Corporation
InventorShiro Tsunai
Life of this patent
Estimating the term…
Abstract
A sensor chip arranged in a casing having a window portion on the side thereof to be faced to a medium to be read takes in the form of a single long chip. In particular, a single long and seamless sensor chip having a plurality of photoelectric conversion elements arranged thereon throughout a length of the window portion of the casing is mounted on a long supporting substrate having a length long enough to support the whole sensor chip. The sensor chip and the supporting substrate are bonded together such that transmission of stress due to external force exerted on the supporting substrate to the sensor chip is restricted.
Claims11
A contact type image sensor comprising:
- a casing having walls, one of said walls being faced to a medium to be read and formed with a rectangular window;
- a single long and seamless sensor chip arranged in said casing, said single long and seamless sensor chip having a plurality of photoelectric conversion elements arranged throughout a length of said rectangular window;
- and
- a supporting substrate having a length large enough to support said sensor chip as a whole, said sensor chip and said supporting substrate being bonded together such that transmission of stress due to external force exerted on said supporting substrate to said sensor chip is reduced.
Dependencies are inferred from the claim text.