Sensor geometry correction methods and apparatus
AssigneeOnWafer Technologies, Inc.
InventorsKameshwar Poolla, Costas J. Spanos
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Abstract
Described are methods and apparatus for collecting measured parameter data for applications such as deriving response models and information required for developing and maintaining processes and process tools. The methods and apparatus are capable of deriving correction factors for the measured data and applying the corrections factors to the measure data so as to provide corrected parameter data having increased accuracy. One embodiment uses warpage geometry to derive the correction factors.
Claims29
A method of deriving operating characteristics for a process tool used for processing workpieces the method being performed with a sensor apparatus having a plurality of detectors, the method comprising the steps of:
- a) loading a sensor apparatus including electronic devices into the process tool;
- b) measuring the operating characteristics with the sensor apparatus;
- c) converting the measured operating characteristics into digital data;
- d) deriving correction factors for warpage induced measurement distortion;
- and
- e) applying the correction factors to the measured data so as to generate corrected data.
An apparatus for acquiring measured parameter data and generating corrected data from the measured parameter data for processing workpieces, the apparatus comprising:
- a base;
- at least one base sensor supported by the base, the sensor being capable of measuring data representing a condition of the base;
- an electronics module supported by the base;
- an information processor substantially contained in the electronics module, the information processor being connected with the base sensor so as to receive data from the sensor the information processor being capable of deriving and applying correction factors.
A method of deriving parameter data for a uniform workpiece using measurements from a sensor apparatus, the sensor apparatus and workpiece having dissimilar warpage properties, the method comprising the steps of:
- a) coupling at least one detector with a first portion of the sensor apparatus, the first portion having substantially uniform properties;
- b) measuring the parameter using the at least one detector of step a;
- c) providing at least one equation for substantially representing the warpage behavior of the sensor apparatus as a function of the parameter;
- d) using the equation derive correction factors;
- and
- e) applying the correction factors to the measured parameters so as to obtain corrected data for the parameters.
An apparatus for generating corrected temperature data for processing substrates in a process tool, the apparatus comprising:
- a base;
- at least one base temperature sensor coupled to the base, the sensor being capable of measuring the temperature of the base;
- an electronics module supported by the base, the electronics module having an information processor;
- the information processor being connected with the base temperature sensor so as to receive temperature data from the sensors, the information processor being capable of calculating correction factors using a warpage geometry for at least a portion of the sensor apparatus;
- the information processor being capable of applying the correction factors to the measured temperatures from the base temperature sensor so as to obtain corrected temperature data.
A computer program product for correcting temperatures measured with a sensor apparatus, the sensor apparatus comprising a semiconductor wafer, and a plurality of temperature sensors coupled to the wafer, the computer program product comprising executable steps for:
- a) acquiring measured wafer temperature data as a function of time and spatial position;
- b) generating additional data by interpolation using the measured wafer temperature data so as to obtain temperatures for least one of a fine time scale and a fine spatial grid scale;
- c) calculating temperature correction factors using a warpage geometry for at least a portion of the sensor apparatus;
- d) reducing the correction factors of step d to at least one of the time scale of the measured temperatures and the spatial grid scale of the measured temperatures so as to correspond to step b;
- and
- e) applying the correction factors to the measured data so as to provide corrected temperatures for the measured temperatures.
A system for collecting and correcting parameter measurements, the system comprising a sensor apparatus for collecting measurement data, an external information processor, and a communication mechanism for transmitting information between the sensor apparatus and the external information processor, the external information processor being capable of generating correction factors using a warpage geometry for at least a portion of the sensor apparatus for correcting the parameter measurements and applying the correction factors to the measured data so as to obtain corrected measurement data.
A computer program product for correcting temperatures measured with a sensor apparatus, the sensor apparatus comprising a semiconductor wafer, and a plurality of temperature sensors coupled to the wafer, the computer program product comprising executable steps for:
- a) acquiring measured wafer temperature data as a function of time and spatial position;
- b) calculating temperature correction factors using a warpage geometry for at least a portion of the sensor apparatus;
- and
- c) applying the correction factors to the measured data so as to provide corrected temperatures for the measured temperatures.
Dependencies are inferred from the claim text.