Chemical mechanical processing system with mobile load cup

A system for processing a substrate comprising:

• a polisher having one or more polishing heads and one or more platens, the polishing heads adapted to retain the substrate against the platens during processing and providing motion therebetween;
• a first motion device disposed adjacent a first side of the polisher, the first motion device being movable along the first side of the polisher;
• a first load cup coupled to the first motion device;
• a second motion device disposed adjacent a second side of the polisher, the second motion device being movable along the second side of the polisher, the second side being opposite the first side of the polisher;
• and
• a second load cup coupled to the second motion device.

A system for processing a substrate comprising:

• a polisher having one or more polishing heads and one or more platens, the polishing heads adapted to retain the substrate against the platens during processing, the platens and polishing heads having a relative motion therebetween;
• a first motion device disposed adjacent a first side of the polisher, the first motion device being movable along the first side of the polisher;
• a first load cup coupled to the first motion device;
• a second motion device disposed adjacent a second side of the polisher, the second motion device being movable along the second side of the polisher, the second side being opposite the first side of the polisher;
• a second load cup coupled to the second motion device;
• and
• a substrate handler disposed proximate a third side of the polisher.

A system for processing substrates comprising:

• a polisher having a first drive system and a second drive system, each drive system having at least one polishing head coupled thereto;
• a first motion device coupled to a first side of the polisher, the second motion device comprising:
• a substrate gripper movably disposed along the first side of the polisher;
• at least one shuttle table having one or more load cups adapted to transfer substrates between the gripper and the polishing head of the first drive system;
• and
• a second motion device coupled to a second side of the polisher, the second motion device comprising:
• a substrate gripper movably disposed along the first side of the polisher;
• at least one shuttle table having one or more load cups adapted to transfer substrates between the gripper and the polishing head of the second drive system.

A method for processing substrates in a polisher comprising the steps of:

• transferring a first substrate into a first load cup located in a first position;
• moving the first load cup proximate a first side of the polisher to a second position;
• moving the first load cup to a third position inward of the second position;
• and
• transferring the substrate from the first load cup in the third position to a first polishing head.

A method for processing substrates in a polisher comprising the steps of:

• transferring a first substrate in a first load cup from a first side of the polisher towards a first polishing station;
• transferring the first substrate to a first polishing head that is supported by a first carousel;
• polishing the first substrate on the first polishing station;
• transferring the first substrate while retained in the first polishing head to a second polishing station;
• polishing the first substrate on the second polishing station;
• transferring the first substrate to a second load cup;
• transferring the first substrate in the second load cup away from the second polishing station towards a second side of the polisher that is opposite the first side.