Method to place a thermal interface when manufacturing an integrated circuit

A method of facilitating heat transfer from a silicon layer during manufacture of an integrated circuit package, comprising:

• providing a silicon layer;
• providing a substrate layer;
• bonding the silicon layer to the substrate layer;
• providing a thermally conductive lid;
• providing a non-organic thermal interface.
• operably disposing the non-organic thermal interface on the silicon layer;
• and
• placing the thermally conductive lid on the silicon layer.

An integrated circuit package manufactured by a method, comprising:

• providing a silicon layer;
• providing a substrate layer;
• bonding the silicon layer to the substrate layer;
• providing a thermal lid;
• providing a thermal interface;
• operably disposing the thermal interface on the thermal lid;
• and
• placing the thermally conductive lid on the silicon layer.

An integrated circuit package manufactured by a method, comprising:

• providing a silicon layer;
• providing a substrate layer;
• bonding the silicon layer to the substrate layer;
• providing a thermal lid;
• providing a non-organic thermal interface;
• operably disposing the non-organic thermal interface on the silicon layer;
• and
• placing the thermally conductive lid on the non-organic thermal interface,
• wherein the non-organic thermal interface is operably disposed on the silicon layer.

A computer system, comprising:

• a memory,
• a central processing unit, the central processing unit manufactured by a method comprising:
• providing a silicon layer;
• providing a substrate layer;
• bonding the silicon layer to the substrate layer;
• providing a thermal lid;
• providing a thermal interface;
• operably disposing the thermal interface on the thermal lid;
• and
• placing the thermally conductive lid on the silicon layer.

A computer system, comprising:

• a central processing unit;
• and
• a memory, the memory manufactured by a method comprising:
• providing a silicon layer;
• providing a substrate layer;
• bonding the silicon layer to the substrate layer;
• providing a thermal lid;
• providing a non-organic thermal interface;
• operably disposing the non-organic thermal interface on the silicon layer;
• and
• placing the thermally conductive lid on the non-organic thermal interface, wherein the non-organic thermal interface is operably disposed on the silicon layer.