Method of forming a damascene structure using a sacrificial conductive layer and the structure so formed
AssigneeInternational Business Machines Corporation
InventorsPeter E. Biolsi, Gregory S. Jankowski, Laurie M. Krywanczyk, Anthony K. Stamper
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Abstract
A method of forming a damascene structure, and the structure so formed, using a sacrificial conductive layer to provide a uniform focus plane for the photolithography tool during formation of circuit features. In particular, a metal layer is provided between the insulative layer and the photoresist, upon which the capacitive sensors of the photolithography tool focus during the formation of the circuit features, namely, troughs and vias.
Claims48
A method of forming a damascene structure, comprising the steps of:
- providing a substrate having an insulative layer;
- depositing a sacrificial conductive layer on the insulative layer;
- and
- forming at least one circuit feature within the insulative layer.
A method of forming damascene lines within an insulated substrate, comprising the steps of:
- depositing a sacrificial conductive layer on the insulated substrate;
- and
- forming at least one circuit feature within the insulated substrate, using a patterning tool, wherein the sacrificial conductive layer provides a uniform focus plane for the patterning tool.
A damascene structure having a sacrificial conductive layer therein providing a uniform focus plane for a photolithography tool during patterning of an at least one circuit feature.
A damascene structure comprising:
- a substrate having an insulative layer;
- a sacrificial conductive layer on the insulative layer;
- and
- at least one circuit feature within the insulative layer of the substrate.
A sacrificial conductive layer used in the formation of a damascene structure, wherein the sacrificial conductive layer provides a uniform focus plane during the formation of an at least one circuit feature.
Dependencies are inferred from the claim text.