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AssigneePixelligent Technologies, LLC
InventorsGregory D. Cooper, Richard M. Mohring
Estimating the term…
The present invention overcomes many of the disadvantages of prior lithographic microfabrication processes while providing further improvements that can significantly enhance the ability to make more complicated semiconductor chips at lower cost. A new type of programmable structure for exposing a wafer allows the lithographic pattern to be changed under electronic control. This provides great flexibility, increasing the throughput and decreasing the cost of chip manufacture and providing numerous other advantages. The programmable structure consists of an array of shutters that can be programmed to either transmit light to the wafer (referred to as its “open” state) or not transmit light to the wafer (referred to as its “closed” state). The programmable structure can comprise or include an array of selective amplifiers. Thus, each selective amplifier is programmed to either amplify light (somewhat analogous to the “open” or “transparent” state of a shutter) or be “non-amplifying” (its “closed” or “opaque” state). In the non-amplifying state, some portion of the incident light is transmitted through the amplifier material. The shutters and selective amplifiers can work in tandem to form a “programmable layer”. A programmable technique is provided for creating a pattern to be imaged onto a wafer that can be implemented as a viable production technique. Thus, the present invention also provides a technique of making integrated circuits. A diffraction limiter can be used to provide certain advantages associated with contact lithography without requiring some of the disadvantages of contact lithography.
A method of exposing a wafer comprising:
A method as in 10 wherein each of said structures further comprises an electromagnetic energy amplifier.
A system of exposing a wafer comprising:
A system as in 24 wherein each of said structures further comprises an electromagnetic energy amplifier.
Apparatus for exposing a wafer using an illumination source, said apparatus comprising:
Apparatus as in 38 wherein each of said means for supporting further comprises an electromagnetic energy amplifier.
A system for exposing a wafer comprising:
A method of making integrated circuits comprising:
A system for making integrated circuits from wafers, the system comprising:
In a semiconductor chip fabrication line, a wafer exposing unit comprising:
A programmable structure for use in microfabrication lithography of a wafer, the programmable structure comprising:
A method of making a programmable mask for use in microfabrication lithography, the method comprising:
A programmable electromagnetic energy modulating structure comprising:
A programmable electromagnetic energy modulating structure comprising:
A diffraction limiter for use in microfabrication, said diffraction limiter comprising a two-dimensional array of transparent regions and opaque regions, said transparent regions having locations individually corresponding to the locations of the active regions of a programmable mask.
A method of exposing a wafer comprising:
A system of exposing a wafer comprising:
A method of exposing a wafer comprising:
In a step and repeat lithography system, a method for electronically aligning an exposure pattern with a wafer having at least one feature, during a microfabrication process, the method comprising:
A programmable structure for use in microfabrication lithography of a wafer, the programmable structure comprising:
Dependencies are inferred from the claim text.