Cooling airflow distribution device

A substantially enclosed cabinet for supporting electronic assemblies to be cooled, the cabinet comprising:

• a base;
• a top panel vertically spaced from the base;
• a first vertical airflow path vertically extending in a direction between the top panel and the base;
• a second vertical airflow path vertically extending in a direction between the base and the top panel;
• brackets for supporting electronic assemblies in a vertical array between the first and the second vertical airflow paths;
• at least one heat exchanger positioned between the base and the brackets for cooling air flowing between the first vertical airflow path and the second vertical airflow path;
• and
• at least one distribution device extending vertically and horizontally between a lower end and an upper end, such that the upper end of the distribution device is closer to the brackets than the lower end, for establishing a predetermined flow rate distribution of cooled air from the base through electronic assemblies supported on the brackets.

A system for removing heat from a plurality of electronic assemblies, comprising:

• A. at least one cabinet supported on a floor and including brackets for supporting electronic assemblies in a vertical array between a first vertical airflow path extending along a first side of the cabinet and a second vertical air flow path extending along a second side of the cabinet, the second side being opposite the first side of the cabinet,
• B. at least one plinth underlying the cabinet below the floor and having, an input port, an output port, at least one heat exchanger disposed along a plinth air flow path extending between the input and the output ports, and at least one fan assembly disposed along the plinth air flow path for driving air through the heat exchanger;
• C. a first insulated duct extending through the floor and connecting the first vertical airflow path of the cabinet and the input port of the plinth, and a second insulated duct extending through the floor and connecting the second vertical airflow path of the cabinet and the ouput port of the plinth;
• and
• D. at least one air flow distribution device for establishing a predetermined flow rate distribution through electronic assemblies supported on the brackets of the cabinet.

A substantially enclosed cabinet for supporting electronic assemblies to be cooled, the cabinet comprising:

• a base for receipt on a floor;
• a top panel vertically spaced from the base;
• a first vertical airflow path vertically extending from near the top panel to an outlet in the base;
• a first insulated duct for extending through the floor and connecting the outlet in the base to a remote heat exchanger;
• a second vertical airflow path vertically extending from an inlet in the base to near the top panel;
• a second insulated duct for extending through the floor and connecting the inlet in the base to the remote heat exchanger;
• a fan positioned in at least one of the insulated ducts for causing airflow between the cabinet and the remote heat exchanger;
• brackets for supporting electronic assemblies in a vertical array between the first and the second vertical airflow paths;
• and
• at least one substantially planar, vertically extending airflow distribution device having a plurality of apertures in a predetermined pattern of sizes and positions for establishing a predetermined flow rate distribution of cooled air from the second vertical airflow path through electronic assemblies supported on the brackets, wherein the combined area of the apertures of the airflow distribution device decreases in a direction extending between the base and the top panel of the cabinet.

A substantially enclosed cabinet for supporting electronic assemblies to be cooled, the cabinet comprising:

• a base for receipt on a floor;
• a top panel vertically spaced from the base;
• a first vertical airflow path vertically extending from near the top panel to an outlet in the base;
• a first insulated duct for extending through the floor and connecting the outlet in the base to a remote heat exchanger;
• a second vertical airflow path vertically extending from an inlet in the base to near the top panel;
• a second insulated duct for extending through the floor and connecting the inlet in the base to the remote heat exchanger;
• a fan positioned in at least one of the insulated ducts for causing airflow between the cabinet and the remote heat exchanger;
• brackets for supporting electronic assemblies in a vertical array between the first and the second vertical airflow paths;
• and
• at least one distribution device extending vertically and horizontally between a lower end and an upper end, such that the upper end of the distribution device is closer to the brackets than the lower end, for establishing a predetermined flow rate distribution of cooled air from the base through electronic assemblies supported on the brackets.

A substantially enclosed cabinet for supporting electronic assemblies to be cooled, the cabinet comprising:

• a base;
• a top panel vertically spaced from the base;
• a first vertical airflow path vertically extending in a direction between the top panel and the base;
• a second vertical airflow path vertically extending in a direction between the base and the top panel;
• brackets for supporting electronic assemblies in a vertical array between the first and the second vertical airflow paths;
• at least one heat exchanger positioned between the top panel and the brackets for cooling air flowing between the first vertical airflow path and the second vertical airflow path;
• and
• at least one substantially planar, vertically extending airflow distribution device having a plurality of apertures in a predetermined pattern of sizes and positions for establishing a predetermined flow rate distribution of cooled air from the second vertical airflow path through electronic assemblies supported on the brackets, wherein the combined area of the apertures of the airflow distribution device decreases in a direction extending between the base and the top panel of the cabinet.

A substantially enclosed cabinet for supporting electronic assemblies to be cooled, the cabinet comprising:

• a base;
• a top panel vertically spaced from the base;
• a first vertical airflow path vertically extending in a direction between the top panel and the base;
• a second vertical airflow path vertically extending in a direction between the base and the top panel;
• brackets for supporting electronic assemblies in a vertical array between the first and the second vertical airflow paths;
• at least one heat exchanger positioned between the base and the brackets for cooling air flowing between the first vertical airflow path and the second vertical airflow path;
• and
• at least one distribution device extending vertically and horizontally between a lower end and an upper end, such that the upper end of the distribution device is closer to the brackets than the lower end, for establishing a predetermined flow rate distribution of cooled air from the base through electronic assemblies supported on the brackets.