IC socket and method of mounting IC package

Abstract

In order to form a sufficient space between the free end portions of the cantilevered spring type of the contacts of the contact sheet for the IC socket and the wires of the test board, to obtain a sufficient elastic displacement of the free end portions of the contacts, and to improve the test efficiency, the IC socket of the present invention comprising the socket frame mounted to the test board through the contact sheet is characterized by comprising the contact sheet having a plurality of cantilevered spring contacts arrayed on the insulating film, and the method of mounting the IC package of the present invention is characterized by comprising a first step of mounting the contact sheet to the carrier concurrently used as a socket frame, and a second step of mounting the carrier to the test board, installing the IC package in the carrier and mounting the pusher.

Dependencies are inferred from the claim text.