Process for the production of electric parts

Abstract

A process for the production of electric parts, comprising performing the step of forming circuit parts on one surface (surface A) of a semiconductor substrate, the step including the introduction of impurities, bonding the surface A of the semiconductor substrate to a holding substrate (BP), performing a back surface treatment step essentially including a polishing of the exposed surface (surface B) of the semiconductor substrate to a thickness of 100 μm or less to obtain an electric-parts-formed thinned substrate, and separating the thinned substrate from the holding substrate (BP), wherein an organic protective coat (RC) is used as a protective coat for the circuit parts on the surface A and the bonding was carried out with the organic protective coat.

Dependencies are inferred from the claim text.