Method of wafer reclaim
AssigneeMacronix International Co., Ltd.
InventorChing-Yu Chang
Life of this patent
Estimating the term…
Abstract
A method of wafer reclaim, at least includes: provide a wafer; perform a first semiconductor process to let both film layer and numerous particles are formed on the wafer; perform chemical mechanical polishing process to let part of film layer is removed and scales of part of particles are decreased; perform wet etching process to let both residual film layer and residual particles are further removed; perform cleaning process to let surface of wafer is cleaned; and perform second semiconductor process to let a semiconductor structure is formed on wafer. Furthermore, concepts of the invention that both film layer and particles are thoroughly removed by both chemical mechanical polishing process and wet etching process can be applied as a method for cleaning wafer and a method for planarizing wafer.
Claims20
A method of wafer reclaim, comprising:
- providing a wafer;
- performing a first semiconductor process, such that both a film layer and a plurality of particles are formed on said wafer;
- performing a chemical mechanical polishing process, such that part of said film layer is removed and scales of part of said particles are decreased;
- performing a wet etching process, such that both residual said film layer and residual said particles are further removed;
- performing a cleaning process such that the surface of said wafer is cleaned;
- and
- performing a second semiconductor process, such that a semiconductor structure is formed on said wafer.
The method of clam 1, wherein material of said film layer is chosen from the group consisting of silicon nitride, silicon dioxide, silicon oxynitride, aluminum, tungsten, borophosphosilicate glass, tetraethyl-orthosilicate glass, and combination of previous elements.
a method for cleaning wafer, comprising:
- providing a wafer;
- performing a chemical mechanical polishing process, such that the surface of said wafer is treated;
- performing a wet etching process, such that the surface of said wafer is further treated;
- and
- performing a cleaning process, such that the surface of said wafer is cleaned.
Dependencies are inferred from the claim text.