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US 2002/0172757 A1Published application
Automated system for dip coating YBCO films on substrates
OwnerChristine L. Vrtis, James Sharpinventors
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OwnerChristine L. Vrtis, James Sharpinventors
Estimating the term…
An automated system for dip coating a superconducting material on a substrate is disclosed. The system includes an actuator, a pick up station, a dip coating station that comprises a reservoir of a dip coating formulation, a drying station that includes a source of heated air and a conveyor for moving the actuator from the pick up station to the dip coating station and from the dip coating station to the drying station. The actuator includes an arm for carrying a substrate. The arm is capable of being moved vertically downward to submerse the substrate in the dip coating reservoir and the arm is also capable of being moved vertically upward to lift the substrate out of the dip coating reservoir. A method for automatically dip coating a substrate with a superconducting material is also disclosed. The method includes the steps of picking up a substrate at a pick up station, conveying the substrate to a dip coating station that includes a reservoir of a dip coating formulation, submersing the substrate in the reservoir of dip coating formulation to form a coating thereon, removing the substrate from the reservoir, conveying the substrate to a drying station that includes a source of heated air, drying the coating of the substrate in the drying station, conveying the substrate from the drying station to a heat processing station and heat processing the substrate.
An automated system for dip coating a superconducting material on a substrate, the system comprising:
A method of dip coating a superconductor coating on a substrate, the method comprising:
The method of 28 wherein the sintering comprises heating the substrate to a first temperature exceeding 800° C. at a first rate in a low oxygen content atmosphere and holding the substrate at the first temperature for about ½ hour to about 1 ½ hours, cooling the substrate in a substantially pure oxygen atmosphere at a second rate to a second temperature, cooling the substrate in a substantially pure oxygen atmosphere to a third temperature at a third rate that is slower than the second rate, and cooling the substrate in a substantially pure oxygen atmosphere to room temperature.
The method of 28 wherein the sintering comprises heating the substrate to a first temperature exceeding 1000° C. at a first rate in a low oxygen content atmosphere and holding the substrate at the first temperature for a time period of about 3 to about 10 minutes, cooling the substrate in a substantially pure oxygen atmosphere at a second rate that is slower than the first rate to a second temperature, cooling the substrate in a substantially pure oxygen atmosphere to room temperature.
Dependencies are inferred from the claim text.