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US 2002/0172585 A1Published application
Device and method for aligning disk-shaped substrates
AssigneeSteag RTP Systems, Inc.
InventorsOttmar Graf, Paul Mantz
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AssigneeSteag RTP Systems, Inc.
InventorsOttmar Graf, Paul Mantz
Estimating the term…
The invention relates to a simple and cost-effective method for aligning substrates. In order to achieve this, the invention provides a device for aligning disc-shaped substrates, in particular semiconductor wafers, comprising an alignment detection unit, at least one first support for receiving the substrate, which forms an oblique plane in relation to the horizontal, a stop against which the substrate can be displaced as a result of the oblique angle and a rotational device for rotating the substrate. The invention also relates to a method for aligning disc-shaped substrates, in particular semiconductor wafers, comprising the following steps: displacement of the substrate into an oblique position in relation to the horizontal, in which the substrate is held on a support which forms a tilted plane in relation to the horizontal and lies against a stop as a result of the oblique angle; rotation of the substrate into a predefined rotational position; and monitoring of the rotational position using a detection unit.
Apparatus (10;30) for the alignment of disk-shaped substrates (12;32), especially semiconductor wafers, with an alignment detection unit, characterized by
Apparatus according to one of the preceding claims, characterized in that the support (24;38) is tiltable.
Apparatus according to one of the preceding claims, characterized in that the abutment (24;38) has at least two abutment pins (24;38) that are spaced from one another.
Apparatus according to one of the preceding claims, characterized in that the rotation device (24;38) is controllable as a function of an alignment of the substrate (12;32) determined by the detection unit.
Apparatus according to one of the preceding claims, characterized in that the support element (22;42) and/or the abutment pins (24;38) are disposed on a common plate (14;36).
Apparatus according to one of the preceding claims, characterized by a second support (18;40) which forms an essentially horizontal plane for the accommodation of the substrate.
Apparatus according to one of the preceding claims, characterized by a device for the measurement of the substrate diameter.
Apparatus according to one of the preceding claims, characterized in that the spacing between the abutment pins (24;38) is adjustable as a function of the substrate diameter.
Apparatus according to one of the preceding claims, characterized in that the first support elements (22;42) are rotatable about a common center point.
Apparatus according to one of the preceding claims, characterized in that the first support elements (22;42) are disposed on a rotatable element.
Apparatus according to one of the preceding claims, characterized by a substrate-handling device for the transport of the substrate (12;32), whereby the movement of the handling device is controllable as a function of the substrate diameter.
Apparatus according to one of the preceding claims, characterized in that the first (22;42) and/or the second support elements (18;40) are synchronously movable in one direction as a function of the substrate diameter.
Method for the alignment of disk-shaped substrates, especially semiconductor wafers, with the following method steps:
Dependencies are inferred from the claim text.