Electronic module with high cooling power
AssigneeThales Avionics, Inc.
InventorsClaude Sarno, George Moulin
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Abstract
The object of the invention is to improve the cooling of electronic modules (40), of the type comprising a printed circuit board (41) contained between two covers (42, 42a, 43). The invention relates more specifically to the extraction by means of at least one of the covers (42, 42a, 43) of heat produced by at least one component (C1, C2, C3) borne by the printed circuit board (41). According to one feature of the invention, the cover (42, 42a, 43) responsible for extracting the heat bears at least one device (50, 50a, 50b, 50c) having a high thermal conductivity, making it possible to even out the temperatures of the surface (S1) of the cover (42, 42a, 43) with which it is in contact. The invention applies to the electronic modules on board aircraft.
Claims7
An electronic module of the type intended to operate in a rack (1), comprising at least one printed circuit board (15), at least one protective cover (42) defining a housing for the board, at least one component (C1) producing heat in operation and mounted via its bottom face on the board, and a thermal link between a top face of the component and the cover, characterized in that the thermal link comprises, interposed between the top face of the component and the cover, a device (50) having a high thermal conductivity, this device having an area (S1) greater than that (S2) of the component and having a thermal conductivity greater than that of the cover.
The electronic module as claimed in one of the preceding claims, characterized in that at least one device (50, 50a, 50b, 50c) having a high thermal conductivity has an elongate shape so as to have a larger dimension (L3), in order to allow this larger dimension (L3) to be oriented the most favorably for cooling the device (50, 50a, 50b, 50c) having a high thermal conductivity.
The electronic module as claimed in one of the preceding claims, characterized in that a cover (42, 43) bearing a device (50, 50a, 50b, 50c) having a high thermal conductivity has an opening (88) formed substantially opposite the device having a high thermal conductivity.
Dependencies are inferred from the claim text.