High-performance heat sink for printed circuit boards

A heat removal apparatus to cool a plurality of components on a board with one or more fans comprising:

• a housing to accept one of said one or more fans and provide flow along said board;
• and
• vanes to direct said flow to cool said plurality of components,
• such that the flow velocity is sufficient to cool each of plurality of components to a respective specified temperatures.

An apparatus for directing a convective flow from one or more fans over printed circuit board mounted heat sinks comprising:

• a first heat sink having a receiving area for mounting at least one of the one or more fans;
• a plurality of vanes for directing flow from the at least one fan towards two or more additional heat sinks;
• and
• a covering over said first heat sink and said plurality of vanes to direct said convective flow over said two or more additional heat sinks,
• where said convective flow over said two or more additional heat sinks uniformly cools said two or more additional heat sinks to approximately the same temperature.

A heat removal apparatus to cool a graphics chip and a plurality of memory chips on a AGP plug-in board with one or more fans comprising:

• a housing to accept one of said one or more fans and provide flow along said board;
• and
• vanes to direct said flow to cool said plurality of components,
• wherein said housing and said vanes are attached to said printed circuit board and protrude from said printed circuit board to a height compatible with a standard AGP board height, and where said flow velocity is sufficient to convectively cool each of plurality of memory chips to a respective specified temperatures.

A heat removal apparatus to cool a graphics chip and a plurality of memory chips on a AGP plug-in board with one or more fans comprising:

• a housing to accept one of said one or more fans and provide flow along said board;
• and
• vanes to direct said flow to cool said plurality of components,
• wherein said housing and said vanes are attached to said printed circuit board and protrude from said printed circuit board to a height compatible with a AGP Pro board height, and where said flow velocity is sufficient to convectively cool each of plurality of memory chips to a respective specified temperatures.